HP_CMOS26G Standard turnaround (~ 7 weeks)
 3 Metal 6 inch Wafers  20      
 Price:                $96,800  

Prices include masks, 6 inch wafers and shipping. 
Dicing wafers and packaging parts is an additional charge.

The available reticle is ~ 17x17mm.  Payload is less allowing for
scribe, die overhead and process control monitors.

Estimated number of parts per reticle = 6
Total number of parts per wafer = 240

Number of good die needed = 928
Number of die needed before yield (87%) = 1070   
Number of die needed before yield (66%) = 1410   

With spares minimum number of wafers to be diced and packaged = 8




Cost per wafer for FDR